| 摘要 |
A general purpose soldering tool holder which will fit most electrically-heated soldering instruments. The tool holder is provided with an external apertured grill to permit the circulation of air therethrough. The outer surface is maintained cool to the touch due to the provision of a heat shield spaced from the grill. The heat shield preferably consists of a material having low-heat transfer characteristics. The soldering instrument is guided by a tip alignment flap forming part of the heat shield. The instrument rests on an intermediate ledge forming part of the tool housing and on an upper rest shaped to accommodate the handle of the soldering instrument. The housing further includes trays for holding a solder spool and a desoldering braid spool which may also be mounted on a shaft. A well is provided in the housing upon which rests a non-wicking foam pad and an outer porous wicking pad for cleaning the tip of the instrument. This will reduce evaporation and subsequent cooling by the cleaning liquid. A cyclindrical opening is provided for housing a flexible sleeve which is threaded and meshes with a corresponding threaded locking bolt for securing the tool holder to a working bench.
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