| 摘要 |
PURPOSE: To obtain a strong connection between a support and a semiconductor body by providing a protruding part that is buried into at least one metal layer in the semiconductor body. CONSTITUTION: A semiconductor body 1 inserts a metal layer 2 and is provided on a support 3. The semiconductor body 1 has a protrusion 4 at a side that opposes the support 3, and the support is constituted of the sharp, continuous protrusion 4, for example, with a triangular section. Them, before the connection between the support 3 and the semiconductor body 1 is completed, the metal layer 2 is provided between the support 3 and the semiconductor body 1, the semiconductor body 1 and the support 3 are pressed mutually while the metal layer 2 is being heated, and the continuous protrusion 4 enters the metal layer 2, thus obtaining a strong connection between the semiconductor body and the metal layer. |
