Electronic component comprises a semiconductor chip having an active front side with semiconductor structures and a passive rear side without semiconductor structures

摘要

Electronic component comprises a semiconductor chip (2) having an active front side with semiconductor structures and a passive rear side without semiconductor structures. The semiconductor structures are accessed via small microscopic conductor strips which lead to contact connection surfaces (4) on the active front side for contacting the semiconductor structures with bonding wires and/or for assembling in flip-chip technology. An Independent claim is also included for a process for the production of the electronic component.