| 摘要 |
A fungicidal composition comprising from 19 wt % to about 50 wt % of a halogenated aromatic dinitrile, from 19 wt % to about 50 wt % of copper salts of fatty and rosin acids, from about 0.05 wt % to about 15 wt % surfactant, and from about 2 wt % to about 60 wt % carrier. The copper salts comprise from about 20 wt % to about 30 wt % copper oleate, from about 15 wt % to about 25 wt % copper linoleate, from about 45 wt % to about 55 wt % copper abietate, and from about 1 wt % to about 2 wt % copper palmitate and copper stearate.
|
