| 摘要 |
A high density double contacting connector assembly for leadless integrated circuit packages. The plastic connector package includes upper and lower header portions each having a plurality of mating terminal reception channels formed therein. The upper header portion includes probing holes to allow ready testing of integrated circuit packages mounted on the connector assembly. Each channel is designed to receive an S-shaped spring-beam contact. Each type of unitary contact includes an IC terminal contacting portion, a generally S-shaped spring-beam portion, a probe portion, a base portion, and a circuit board contacting portion. Each contact is provided with U-shaped pivot on the base portion for engaging a wall of the terminal reception channels. Preloading means formed in the upper header portions insure that all contacts are automatically preloaded when the upper and lower header portions are secured together.
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