| 摘要 |
<p>PURPOSE:To improve the reliability of products by shortening assembling time while removing a temperature cycle, by constituting a pellet junction part and a wire junction part both by the same machine. CONSTITUTION:Lead frame 7, contained in a case by loader part 1, is supplied to horizontal shoot by several pawls, which carries it horizontally and intermittently, and then carried in sequence. At junction part 2, a collet with adsorption-held semiconductor pellet 9 moves and the pellet is thermally pressure-welded to a carried frame. A wire is taken out from a capillary which can move horizontally and vertically and fused into pieces and the frame carried by shoot 21 is connected 3 to the pellet by the wire. The pellet conection mechanism and wire connection mechanism, mounted on the common frame carrier mechanism, interlock together and also control the temperature of the heat block so that the temperature of the pellet and lead frame will change smoothly between both processes. Lastly, it is lifted by shoot 80 to unloader part 4. Consequently, no cracking occurs to a semiconductor and characteristics of parts never deteriorate.</p> |
