发明名称 |
Method of silver (AG) electroless plating on ITO electrode |
摘要 |
A method of silver (Ag) electroless plating on an indium tin oxide (ITO) electrode comprises preparing a substrate on which the indium tin oxide (ITO) electrode is formed, depositing tin (Sn) on the indium tin oxide (ITO) electrode, depositing silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an activation solution and plating silver (Ag) on the indium tin oxide (ITO) electrode by dipping the indium tin oxide (ITO) electrode into an electroless plating solution containing magnesium ions and silver ions.
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申请公布号 |
US6806189(B2) |
申请公布日期 |
2004.10.19 |
申请号 |
US20020330431 |
申请日期 |
2002.12.30 |
申请人 |
LG.PHILIPS LCD CO., LTD. |
发明人 |
KIM JAE-JEONG;CHA SEUNG-HWAN |
分类号 |
H01L21/288;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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