Magnetic head provided with resin-molded IC bare-chip between height-restriction plate and suspension and method for manufacturing magnetic head

摘要

A height-restriction plate having a size in plan view larger than that of an IC chip is bonded to an upper face of the IC chip which is fixed to a FPC formed along a suspension. The IC chip is sealed at the periphery thereof with an adhesive which reaches the height-restriction plate and the FPC.