发明名称 INDUCTIVE COIL MODULE
摘要 <p>A plurality of inductive coils (Fig. 4; 10-10) are mounted in a coil module (30) which is comprised of an elongated housing (31). A potting compound (44) encapsulates the mounted coils (10-10) and a layer of epoxy (46) covers the compound. Leads (11 and 12) from the coils (10-10) are attached to a pair of connectors (42 and 43) which are partially embedded in the epoxy (46) and project through an opening (32) in the housing (31). </p>
申请公布号 WO1979001044(A1) 申请公布日期 1979.11.29
申请号 US1979000273 申请日期 1979.04.30
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