摘要 |
<p>A plurality of inductive coils (Fig. 4; 10-10) are mounted in a coil module (30) which is comprised of an elongated housing (31). A potting compound (44) encapsulates the mounted coils (10-10) and a layer of epoxy (46) covers the compound. Leads (11 and 12) from the coils (10-10) are attached to a pair of connectors (42 and 43) which are partially embedded in the epoxy (46) and project through an opening (32) in the housing (31). </p> |