| 摘要 |
Electrical and elctric component are temporarily stabilized in pre-determined position on a circuit board with their leads extending through holes in the board, by means of a selected, solid, solder-compatible material which couples the leads and the board to one another. The material preferably is one which does not decompose at soldering temperature, but instead should have a melting point or liquidus temperature below that of solder. The component leads may then be trimmed to finish length with the components in position on the board, and the components may then be soldered in place in a single soldering step using known techniques. The stabilizing material is melted and displaced simultaneously with the soldering. In a preferred embodiment of the invention compatible flux active agents are admixed with the stabilizer material. |
