| 摘要 |
<p>A semiconductor electronic device (10) operates at high power levels using structured copper to reduce generation of stress between the elements of the device during thermal cycling in the course of normal operation. Structured copper strain buffers (14, 24) are used to attach each side of a silicon wafer (12) to fluid cooled heat sinks (20, 30) to provide efficient removal of heat generated by the device and good electrical connection to the silicon wafer. </p> |
