| 摘要 |
Composite film adhesive including a layer of resin adhesive which is heat activatable for adhesion to plasticized resin and which is resistant to plasticizer migrating from the resin and a layer of phenoxy resin which is in strongly adhesive, overall engagement with the heat activatable resin and has active hydrogens for reaction with free NCO groups of a urethane adhesive to enable strong bonding of the phenoxy resin layer by the urethane adhesive.
|
