| 摘要 |
A tool is described for the holding and insertion of integrated circuit (IC) packages of the type having a metallic heat sink member fused to the chip-enclosing ceramic body. The heat sink member includes a locator or registration hole. The tool finds particular application in connection with a patented high package density island configuration wherein each IC package is secured by means of the registration hole on a retention post of a connector which is mounted between, and in close proximity to, adjacent parallel sections of the island cooling frame. The IC package heat sink member has at least one integral extension adapted to contact the frame. In performing its holding and insertion function, the tool is capable of engaging the sides of the registration hole. The assembler may then convey the IC package to the connector in which it is to be mounted, and positions the hole above the connector retention post. The application of pressure upon the tool directed substantially perpendicular to the connector, inserts the chip into the connector body and onto the retention post. The tool is then withdrawn. The entire operation requires no actual digital contact with the package by the assembler.
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