| 摘要 |
<p>PURPOSE:To eliminate the fragileness breakdown caused by the difference of the heat expansion by providing the welding conductor layer on the upper surface via the ceramic frame instead of the metal sealed frame when forming the lamination alumina ceramic substrate. CONSTITUTION:Ceramic frame 12 is attached to upper surface 14 of lamination ceramic substrate 21 by surrounding the concavity which is to be used as semiconductor element sealing part 2. Then the W paste is printed on the upper surface of part 2, internal lead 3, external lead soldering part 5 leading from lead 3 via concucting layer 13 and frame 12 each, thus forming the metalized layer through burning. The Ni plating is applied there, and external lead 7 is attached to part 5 via Ag-Cu solder material. At the same time, 3-layer structure cap welded conductor 15 composed of the metalized layer, Ni plating layer and Ag-Cu solder material is formed on the upper surface of frame 12. The package is formed in such structure with semiconductor element 8 adhered. Then the electrode and lead 3 are combined with metal thin wire 9, and metal cap 21 is put onto frame 12 to be welded to conductor 15.</p> |
