发明名称 METHOD OF MANUFACTURING THIN FILM TRANSISTOR SUBSTRATE
摘要 A method for manufacturing a TFT(Thin Film Transistor) substrate is provided to adjust the composition ratio of etching gas used in the dry etching process of a first photo resist, thereby removing a metal oxide film and polymer residue formed on a metal film for data and preventing the generation of stringer. A method for manufacturing a TFT substrate(110) comprises the following steps of: forming a gate insulating film(130), an active layer(140), and a metal film(150) for data successively on the substrate on which a gate line(122) is formed; forming a first photo resist pattern that a channel forming area(154) has a relatively thin thickness in comparison to a different area on the metal film for the data; performing the first etching of the metal film for the data using the first photo resist pattern; performing the active layer using the first photo resist pattern; performing the dry etching of the first photo resist pattern with gas mixing SF6(Sulphur Hexafluoride) and O2(Oxygen) in the ratio of 1:4 to 1:20 to form a second photo resist pattern(162) of which the channel forming area is removed; and performing the second etching of the metal film for the data using the second photo resist pattern.
申请公布号 KR20080036282(A) 申请公布日期 2008.04.28
申请号 KR20060102709 申请日期 2006.10.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, DUCK JUNG;KIM, KYUNG SEOP;LEE, YONG EUI;PARK, MYUNG IL;LEE, DONG CHIN
分类号 G02F1/136 主分类号 G02F1/136
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