发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To make it possible to perform a low-temperature sealing with a good light transfer characteristic of a light transmission part by sealing a bar-shaped cap material, where a glass plate for light transmission is fixed to the upper face side or the lower face side of the window part directly or through intermediate materials, in a base assembly by welding. CONSTITUTION:Base assembly 10 has a ceramic base haivng the chip arrangement part, where a semiconductor chip should be arranged, in the face side opposite to cap assembly 30 and frame material 20 which is fixed onto the chip while surrounding the chip arrangement part and can be welded. Meanwhile, assembly 30 is provided with frame material 31 which should be superposed onto frame material 20 and can be welded, and glass plate 37 for light transmission is equipped in the upper side face or the lower side face so that the window part of material 31 may be enclosed. As a result, a low-temperature sealing can be performed with a good light transfer characteristic of the light transmission part by superposing rame materials 20 and 31 onto each other and welding and sealing them.
申请公布号 JPS54146985(A) 申请公布日期 1979.11.16
申请号 JP19780054498 申请日期 1978.05.10
申请人 HITACHI LTD 发明人 TSUNENO HIROSHI;OKIKAWA SUSUMU;HORIUCHI KATSUTADA;KITAMURA WAHEI;YAMAMOTO EIJI
分类号 H01L23/02;H01L21/8247;H01L27/14;H01L29/788;H01L29/792;H01L31/0203;H04N5/335;H04N5/372 主分类号 H01L23/02
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