PRINTED CIRCUIT BOARD AND METHOD OF THE SAME, APPARATUS FOR DRILLING VIA HOLE

摘要

A printed circuit board and a method of manufacturing the same, and an apparatus for drilling a via hole are provided to prevent short-circuit between circuits and reduce fault ratio due to eccentricity between insulating layers. A method of manufacturing a printed circuit board includes the steps of: forming a first circuit pattern including a reference mark and a land for a via on one surface of an insulation substrate(S100); stacking an insulation layer the one surface of the insulation substrate(S300); stacking a metallic layer on the insulation layer(S400); opening a first window corresponding to the reference mark by selectively removing the metallic layer(S500); and forming the via electrically connecting the metallic layer to the land for the via by irradiating light onto the other surface of the insulation substrate and recognizing the reference mark through the first window(S600).