THIN PLATE FLATTENING CORRECTION MECHANISM

摘要

PURPOSE:To secure a flat adsorption of the thin plate onto the surfaces of the cylindrical component and the electrostrictive element by providing the electrostrictive element to the hollow part of the cylindrical component. CONSTITUTION:Mask 17 featuring the concave warp is put onto the holder composed of cylindrical component 11 and electrostrictive element 13. Then the mask and the holder are adsorbed by absorption 16 and via hole 14 and groove 15. Accordingly, element 13 warps downward according to the warp of the mask. A fixed amount voltage is applied to element 13 to warp the element and thus to secure the same level for the upper surface of the element as end face 11a of the cylindrical component. In this way, even the slight warp can be corrected.