STACKED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A stacked semiconductor device package and a manufacturing method thereof are provided to enhance physical and electrical reliability by forming a reliable stacked structure. Each of semiconductor elements includes a plurality of bonding pads disposed on an upper surface thereof, a lower surface opposing the upper surface, through-hole electrodes(122) having lower protrusions, and a first adhesive material layer(130) formed on the upper surface to obtain an upper surface of the same height as the height of the upper surface of the through-hole electrodes. A second adhesive material layer is formed to cover the through-hole electrodes and the first adhesive material layer. The second adhesive material layer is punched by using the protrusions of the through-hole electrodes so that the through-hole electrodes are connected to each other. The first adhesive material layer includes a material to be patterned. The second adhesive material layer includes a material to be punched.