APPARATUS FOR MOLDING LED PACKAGE AND METHOD THEREFOR

摘要

An apparatus for molding an LED package and a method therefor are provided to implement the color balance of the LED package by forming the dummy space at the air diffuser in order to distribute the fluorescent substance uniformly. A resin input part(12) injects a liquid resin into a forming space(15). The liquid resin comprises the fluorescent substance by the transfer molding method. After the liquid resin is filled in the forming space, the molding material is formed by hardening of the liquid resin. An air diffuser(17) is connected to the forming space. After the liquid resin completely fills up the forming space, the liquid resin is ejected to the air diffuser. The air diffuser comprises a first vent(17a), a dummy space(17b) and a second vent(17c). The dummy space keeps a part of the liquid resin flowed through the first vent. The dummy space is bigger than the first vent.