METHOD OF DIFFUSION BONDING FOR MICROCHANNEL PLATES

摘要

FIELD: technological processes; electricity. ^ SUBSTANCE: invention may be used in manufacture of electronic devices with microchannel plates (MCP), in particular, for bonding of MCP with intermediate insert from dielectric material. Microchannel plate (MCP) and dielectric insulator are coated with thin film from appropriate metal selected based on condition of optimal diffusion. Plated MCPs and dielectric insulator are joined and installed into joining device that provides required force applied to components for initiation of diffusion connection process. Connection device is then installed in vacuum thermal chamber for acceleration of diffusion bonding process between MCP and dielectric insulator. ^ EFFECT: bonding without fixators and solders for brittle material with low shear strength. ^ 12 cl, 5 dwg