METHOD OF PRODUCING HYBRID IC CIRCUIT

摘要

Electronic components and a conductor for connecting the electronic components are placed in the component positioning holes and the conductor positioning recess which are formed in a plate-shaped jig. The jig with the components and the conductor is placed over a mounting board, and the assembly of these elements is heated in a suitable furnace so that the electronic components are connected to the mounting board and the conductor simultaneously, thereby to reduce the number of steps of manufacturing the hybrid integrated circuit assembly.