| 摘要 |
PURPOSE:To sufficiently prevent migration after resin sealing by winding wires of noble metals to the ends of metal lead frames and fabricating these flat thereby forming the noble metal covering to the ends of the lead frames. CONSTITUTION:Noble metal wires 6 of a specified diameter are wound to the ends of the assembly of metal lead frames 5 used at the time of assembling of semiconductor devices. The ends of these noble metal wires 6 are rolled for each noble metal wire 6 to form pads 7 of a flat face, whereby the covering of noble metals is formed to the ends of the lead frames 5. This method makes possible soldering of transistors 3 on the pads 7 having been covered with noble metals and further makes possible internal wiring connection onto the covering of the pads 7. With the use of noble metals as a minimum requirement, difficult-to-migrate metals are used for the noble metals to prevent the migration after resin sealing. |
