| 摘要 |
According to the present invention, provided are a thermosetting epoxy resin composition for the encapsulation of an optical semiconductor element, which has excellent handling properties, transparency and crack resistance; and to an optical semiconductor device having an optical semiconductor element encapsulated by using the same. According to the present invention, the thermosetting epoxy resin composition for the encapsulation of an optical semiconductor element comprises: (A) a prepolymer obtained by making ingredients (A-1), (A-2), (A-3) and (A-4) react so that the ratio of epoxy equivalent weight to acid anhydride equivalent weight is 0.6-2.0; and (B) a hardening accelerator including an onium salt represented by formula (1), X^+Y^-, wherein X^+ represents a cation and Y^- represents an anion. The ingredient (A-1) is a triazine derivative epoxy resin; the ingredient (A-2) is at least one epoxy resin selected from the group comprising a bisphenol A epoxy resin, a bisphenol F epoxy resin, a hydrogenated bisphenol A epoxy resin and an alicyclic epoxy resin; the ingredient (A-3) is an acid anhydride hardener which is in a liquid state at 50°C; and the ingredient (A-4) is a plasticizer selected from polycaprolactone polyol, polycarbonate polyol and an acrylic block copolymer. |
