SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

An embodiment of the present invention relates to a sensor package and a manufacturing method thereof. The technical objective of the present invention is to reduce thickness and manufacturing costs. To achieve the objective, the manufacturing method of a sensor package comprises the steps of: preparing a first semiconductor die where a first bond pad is formed; bonding a second semiconductor die, where a second bond pad is formed, to the first semiconductor die; forming a first passivation layer on the first and the second semiconductor die so that the second bond pad is exposed to the outside; connecting the first and the second pad using a redistribution layer; and connecting a conductive bump to the redistribution layer.