| 摘要 |
PURPOSE:To suppress the growth of whiskers from a tin coating in a manufacturing method for a semiconductor device using a lead wire plated with tin, by previously fusing tin on the lead wire before the lead wire is connected and then by connecting the wire. CONSTITUTION:Tip 17 applied by plating onto core metal 16 of lead wire 15 projected from tape-shaped resin film 9 has metallic fiber 18, called whiskers, naturally growing. Tin 17 is fused to fuse the whiskers by a heat treatment. Then, lead wires 15 are connected to semicnductor element 13 with several electrodes 14 by thermal pressure welding or by soldering. Then, lead wires 15 connected to semiconductor element 13, after being cut to a required length and formed, are connected to conductor 12 by fixing semiconductor element 13 ont conductor layer 12' provided onto substrate 11 made of ceramics, etc. |
