Mounting structure and manufacturing method for same

摘要

In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal (4) of an electronic component (1) and an electrode terminal (5) of a substrate (2) contains an alloy (8) and a metal (9) having a lower modulus of elasticity than the alloy (8). The junction has a cross section structure in which the alloy (8) is surrounded by the metal (9) having the lower modulus of elasticity.

主权项

1. A mounting structure comprising:
an electronic component having a plurality of first electrode terminals; a substrate having a plurality of second electrode terminals; and a plurality of junctions, each of which contains an alloy and a metal, the metal having a lower modulus of elasticity than the alloy, each of the junctions connecting a respective one of the first electrode terminals to a respective one of the second electrode terminals, wherein each of the plurality of junctions has a cross section structure containing a plurality of cross sections that are parallel to a plane of the substrate, and including the alloy that is surrounded by the metal having the lower modulus of elasticity, a first maximum proportion of the metal in any of the plurality of cross sections for a first one of the plurality of junctions disposed toward an outer periphery relative to the electronic component is greater than a second maximum proportion of the metal in any one of the plurality of cross sections for a second one of the plurality of the junctions disposed toward a center relative to the electronic component, and the electronic component is curved, and a first thickness of the first one of the plurality of the junctions is greater than a second thickness of the second one of the plurality of the junctions, the first and second thickness being perpendicular to the plane of the substrate.