Polymer member based interconnect

摘要

An interconnect (124) suitable for attachment of integrated circuit assemblies to each other comprises a polymer member (130), possibly dielectric, coated with a conductive material (144) which provides one or more conductive lines. In some embodiments, the conductive material covers a part, but not all, of the polymer member. In some embodiments, multiple conductive lines are formed on the polymer member. In some embodiments, the polymer member is conductive. Such interconnects replace metal bond wires in some embodiments. Other features are also provided.

主权项

1. A first structure comprising:
a substrate comprising a top surface and comprising circuitry with one or more contact pads at the top surface; a first microelectronic component disposed on a first region of the substrate; a plurality of first members disposed on a second region of the substrate, each first member comprising a dielectric core comprising one or more polymers, each first member also comprising a plurality of conductive lines each of which extends on a sidewall surface of the dielectric core of the first member and extends from the second region of the substrate to a top of the first member, each conductive line being electrically connected to at least one said contact pad; and wherein each conductive line comprises one or more contact pads for connecting the corresponding first member to one or more second microelectronic components.