High power electronic component with multiple leadframes

摘要

In an embodiment an electronic component includes a semiconductor die having a first surface, the first surface including a first current electrode and a control electrode. The electronic component further includes a die pad having a first surface, a plurality of leads and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads. The first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead.

主权项

1. An electronic component, comprising:
a semiconductor die having a first surface, the first surface comprising a first current electrode and a control electrode; a die pad comprising a first surface; a plurality of leads, and a gull-wing shaped conductive element coupled to a first lead of the plurality of leads by a spot weld connection, wherein the first current electrode is mounted on the die pad and the gull-wing shaped conductive element is coupled between the control electrode and the first lead, wherein the gull-wing shaped conductive element comprises a first end having a first surface that is substantially coplanar with the first surface of the die pad, wherein the semiconductor die extends between the die pad and the first end of the gull-wing shaped conductive element, wherein the gull-wing shaped conductive element is provided as a separate piece from the first lead of the plurality of leads, wherein the die pad has an L-shaped configuration in plan view.