Semiconductor device of high power density - making contact with liquid metal filled capillary structures near coolers

摘要

A semiconductor device of high power density has contacts directly with thermal and electric liquid-metal contacts which are in connection with cooler elements and surrounded by an insulating housing. The contact areas of the semiconductor device are a part of a horizontal capillary structure which is filled with liquid metal. A second peripheral capillary structure magnifies the heat transmission area to the cooler elements. The result is a contact system of the semiconductor wafer which requires either no pressure or a pressure of 150N/cm2(100N/cm2).