| 发明名称 |
IN KUNSTSTOFF EINGEBETTETE HALBLEITERVORRICHTUNG |
| 摘要 |
<p>A semiconductor device sealed in a resin composition, wherein the resin composition contains the prescribed percentages of inorganic fillers having extremely small amounts of impurities, epoxy resin having an epoxy equivalent of 250 or less and a softening point of 120 DEG C. or less, hardening agent, hardening promoter and low melting paraffins.</p> |
| 申请公布号 |
DE2916954(A1) |
申请公布日期 |
1979.10.31 |
| 申请号 |
DE19792916954 |
申请日期 |
1979.04.26 |
| 申请人 |
TOKYO SHIBAURA DENKI K.K. |
发明人 |
YOSHIZUMI,AKIRA;IKEYA,HIROTOSHI;WADA,MORIYASU |
| 分类号 |
H01B3/00;H01B3/40;H01L23/29;(IPC1-7):H01B3/40 |
主分类号 |
H01B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
