| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emission device that can secure more excellent adhesion of various kinds of members constituting the light emission device.SOLUTION: A light emission device has a board 14 having a substrate 11 and plural wiring portions 12 provided on at least one surface of the substrate 11, a first coating portion 13 which covers the wiring portions 12 and exposes some of the wiring portions 12, plural light emission elements 15 arranged on the wiring portions 12 exposed from the first coating portion 13, and a second coating portion 19 disposed to surround each light emission element 15 on the first coating portion 13, and a resin portion 18 for sealing the board 14 and the light emission element 15. The resin portion 18 is disposed in contact with the first coating portion 13 and the second coating portion 19, and the second coating portion 19 is formed of a material having higher reflectivity than the first coating portion 13.SELECTED DRAWING: Figure 1B |
