| 摘要 |
SOLUTION: There is provided an electrolytic copper foil 1 used in the manufacture of a copper foil laminate, in which a surface factor SC value that a first surface 1a to which no resin film 2 is stuck has is in a range of 2.21-4.09, and the surface factor SC value is a ratio of a real surface area to a measured unit area that the first surface 1a has.EFFECT: An SC factor of an outside surface 1a to which no resin film 2 is stuck in both surfaces of a copper foil is adjusted at a fixed level, to thereby minimize a slip phenomenon occurring on a contact surface between a roll and a copper foil 1 in a step of laminating a copper foil laminate and the resin film 2, and thereby a yield of the copper foil laminate can be increased.SELECTED DRAWING: Figure 1 |
