LIQUID UNDERFILL MATERIAL COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND FLIP CHIP TYPE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a liquid underfill material composition having an excellent curability dispensing with a cure catalyst, low viscosity, excellent thin film invasiveness, adhesiveness, and high heat resistance.SOLUTION: The liquid underfill material composition for semiconductor encapsulation comprises: a cyanate ester resin (A) having 2 or more cyanato groups in a molecule; a phenol curing agent (B) including a resorcinol type phenol resin; an inorganic filler (C) composed of a (C-1) constituent of an inorganic filler A which is silica having an average particle size of 0.1-3 μm and a (C-2) constituent of an inorganic filler B which is amorphous nano-silica having an average particle size of 5-70 nm.SELECTED DRAWING: None