| 摘要 |
FIELD: technological processes; electricity.SUBSTANCE: invention relates to production of inserts equipped with electronic module (44) containing microchip and antenna (43). To achieve result sheet substrates (46) are provided for several inserts, herewith substrates have cavities for subsequent installation of electronic module in each cavity; antenna is provided for each insert; at least one layer of adhesive is provided; electronic module is provided for each insert; bottom sheet substrate (46), first adhesive layer, several antennae (43), second layer of adhesive and upper sheet substrate (46) are applied on each other and assembled by means of lamination; laminated assembly is cut so that to produce inserts, each of which has antenna; electronic modules (44) are installed in cavity after lamination of sheet substrates (46), antennae (43) and adhesive layers and additionally on the inner side of at least one of sheet substrates (46) printed layer of thickness compensation is applied outside substrate (46) zone intended for antenna placement.EFFECT: higher manufacturability of flat electronic inserts.6 cl, 7 dwg |
