| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip resistor that can be enhanced in yield.SOLUTION: The chip resistor has an insulation substrate 11, a resistor 13 formed on the insulation substrate 11, a first protection film 14 which is configured to cover the resistor 13 and formed of glass as a main component, and a second protection film 16 which is configured to cover the first protection film 14 and formed of resin. The first protection film 14 is formed to have the same width as the insulation substrate 11, and a groove portion 18 is provided to the first protection film 14 which is located between the resistor 13 and side portions 11a, 11b in the width direction of the insulation substrate 11 and covered by the second protection film 16.SELECTED DRAWING: Figure 2 |
