| 摘要 |
PURPOSE:To prevent an error connection by removing a resin film right under a metal film where a connection is made. CONSTITUTION:A fixed pattern is formed on polyamide resin film 11 of approximate 30mu in thickness and a pattern of copper foil 12 plated with gold or silver is adhered onto the film by pressure. Further, resin film 11 never resides on the reverse surface of part 16 where a connecton of copper foil 12 is made. As a result, pressure applied to wire 17 and copper foil 12 by capillaries is used effectively and is never absorbed by a softened resin film as usual, so that the connection will be made accurately in a short time. |
