| 摘要 |
A conveying apparatus includes a holding plate having a holding surface destined to face a surface of a wafer to be held; a restriction member on one end side of the holding surface adapted to contact the periphery of the wafer so as to restrict movement of the wafer; and a moving unit adapted to move the holding plate. At the holding surface, a non-contact type suction holding part is adapted to jet a fluid obliquely to the surface of the wafer to be held so as to move the wafer toward the restriction member and generate a negative pressure between the holding surface and the surface to be held, thereby holding the wafer by suction. The fluid is jetted from the suction holding part so as to abut the wafer against the restriction member, thereby positioning the wafer at a predetermined position on the holding plate. |
