发明名称 Solid state relay having U-shaped conductive heat sink frame
摘要 A novel solid state relay package has a U-shaped metallic frame which defines three surfaces of the general rectangular relay package. The open end of the U receives a circuit board containing most of the relay components. The interior of the frame is then filled with a solid plastic insulation material and terminal pins extending from the terminal board pass through the bottom of the solid plastic material to be accessible for external contact. The top of the housing receives a second terminal assembly for receiving power terminals connected to the main relay switching device and an LED indicator which is visible through the conductive U-shaped frame to indicate whether the relay is open or closed.
申请公布号 US4172272(A) 申请公布日期 1979.10.23
申请号 US19780901698 申请日期 1978.05.01
申请人 INTERNATIONAL RECTIFIER CORP 发明人 SCHNEIDER, STANLEY
分类号 H05K5/00;H05K5/06;(IPC1-7):H05K7/20 主分类号 H05K5/00
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