| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A power device 5 comprises: a semiconductor chip 2; a chip-mounting part 1c; a solder material 6 that electrically connects a rear face electrode 2e of the semiconductor chip 2 to an upper surface 1ca of the chip-mounting part 1c; a plurality of inner lead parts 1a and outer lead parts 1b electrically connected to an electrode pad 2d of the semiconductor chip 2 via a wire 4b; and an encapsulation body 3 that encapsulates the semiconductor chip 2 and the wire 4. Further, a recessed part 2f is formed at a peripheral edge part of a rear face 2b of the semiconductor chip 2. The recessed part 2f has a first surface continued to the rear face 2b, and a second surface continued to the first surface. A metal film is formed on the first surface and the second surface of the recessed part 2f.SELECTED DRAWING: Figure 2 |
