发明名称 PREPARATION OF THERMOSETTING RESIN SHEET MOLDING COMPOUND
摘要 PURPOSE:To prepare a thin and broad sheet molding compound having high thickness accuracy, continuously, in high efficiency, by extruding a normally solid thermosetting resin with an extruder and a sheeting controlling the extrusion condition within a specific range. CONSTITUTION:A thin and broad sheet having a thickness of 0.5-5 mm and a width to thickness ratio of 300-2,000, is stably and continuously manufactured by extruding a compound composed of 100 parts by weight of a thermosetting resin which is solid at room temperature and contains a component having a molecular weight of >=1,500 and that of <=1,000 in a weight ratio of 95:5-40:60, and pref. 5-70 parts by weight of glass fiber, with an extruder and a sheeting die, under the following extrusion conditions: extrusion temperature; between the softening temp of the resin and the temp. at which 10% of the resin cures within 30 min.: and the average residence time of the resin in the extruder and the die; between 1 min. and 1/2 X (the time in which 10% of the resin cures at the extrusion temperature).
申请公布号 JPS54135859(A) 申请公布日期 1979.10.22
申请号 JP19780043460 申请日期 1978.04.13
申请人 ASAHI CHEMICAL IND 发明人 YUASA TAKEO;IBATA JIYOUJI;KATOU MICHIO;TSURUTA NAOHIRO
分类号 B29B7/00;B29C47/00;B29C47/14;B29C47/38;B29C47/92 主分类号 B29B7/00
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