| 摘要 |
<p>PURPOSE:To divide a wafer into chips with a good yield in a short time by deforming the wafer due to the suction pressure as well as the pressure dependent upon high-pressure gas at the same time. CONSTITUTION:Wafer 1 where cut grooves are formed is put on the concave part of receiving stand 4, and thin sheet 3 is put on wafer 1 so that thin sheet 3 may cover the whole of the concave part of receiving stand 4. Next, upper cap 8 is placed above them, and further, upper cap 8 and bottom cap 7 have the circumference edge fixed by binding tool 10. Under this state, gas is fed from gas leading- in hole 9 and is exhausted from exhaustion tube 6 in vacuum to deform wafer 1 by pressure, thus dividing wafer 1 into chips along cut grooves.</p> |
