| 摘要 |
{PG,1 A method of making a semi-conductor heat sink mounting includes two extrusion steps. Initially, a substantially cylindrical copper billet having an upper cylindrical locating portion of reduced diameter is formed. A steel ring is then brazed to the copper billet such that it surrounds the locating portion. The copper billet and the steel ring are then extruded to form a sink body portion, a pedestal portion extending upwardly from said body portion defining a disc receiving recess therein, and a resistance welding ridge surround the pedestal portion. A molybdenum disc is brazed into the disc receiving recess. A stem is then extruded downwardly from the body portion of the heat sink mounting as a substantially evenly distributed downward force is applied to the heat sink body portion, the pedestal portion and the molybdenum disc. This evenly distributed downward force prevents structural failure of the molybdenum disc by maintaining the disc in compression while the stem portion and the body portion of the heat sink mounting are worked to a full hard state. |
