DEVICE FOR AUTOMATICALLY MATCHING TWO SUPERPOSED ARTICLES SUCH AS SEMICONDUCTOR WAFER AND TRANSPARENT MASK

摘要

1326178 Optical object alignment KASPER INSTRUMENTS Inc 21 March 1972 [22 March 1971] 13223/72 Heading H4D In apparatus for automatically aligning a semi-conductor wafer 11 with a mask 16, Fig. 1 in the manufacture of integrated circuit devices, the mask 16 and wafer 11 are each provided with pairs of alignment patterns 17, 18 and 11, 12, the wafer pattern co-operating with the mask pattern in a unique visual manner to signify alignment. Photoelectric scanning means 31, 36 automatically scan the pattern areas and producing output signals indicative of the relative position of the wafer and mask patterns. Logic circuitry in response to said scan output signals compute formulae responsive to any misalignment, which are utilized to produce control signals for driving motor means 26-28 to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on a finalized alignment. A tolerance selection means is provided for permitting a variation in final alignment tolerance. An initial coarse visual alignment step is used. The desired relative positions of single-line cross-marks 12 and 13 and double line crossmarks 17, 18 are with lines 14, 15 half way between double lines 19, 21 and 22, 23 respectively, Fig. 2. The scanning means comprises a single photodetector 36 behind a moving belt shutter 31, having in order of use, slit apertures 32, 34, 33, 35, respectively detecting lines: 14, 19, 21 (12, 17); 14, 19, 21 (13, 18); 15, 22, 23 (12, 17); 15, 22, 23 (17, 18). Photodetectors 39 and 40 co-operate with respective holes 37 and 38 to give pulse indications of which line is being scanned by which aperture. After pulse shaping in means 45, pulses 41 (line 14); 42 (19), 43 (21) Fig. 3 are produced and corresponding interpulses A1-C11 are produced by generators 49, 53. The patterns are scanned twice, the first time to establish the direction of the pattern misalignment and the second time to establish the exact amounts of the misalignment. The tolerance within which alignment will be accepted is adjustable. Pulses A1-C1, A111-C111, for each of the four scans (four slits 33-35), one converted into three clock pulse trains. The width of pulses C1 and C11 are constant, being indicative of the spacing of lines 19 and 21 and being represented to by 2,000 clock pulses in the computing circuitry. The three clock pulse trains are fed to respective ones of three UP/DOWN counters in such manner that the direction of misalignment of the patterns is given by that counter storing the C1, C11 clock pulse count, whilst the amount of the misalignment is given by the other counter contents. Extensive circuit details are given.