| 摘要 |
Sorting and stacking tested conductor plates by forming from the bottom up a stack of conductor plates which have passed the tests, raising from the bottom the entire stack each time a tested conductor plate approaches the bottom of the stack, feeding each tested conductor plate beneath the raised stack to temporary support means, actuating the temporary support means to eject a failed said plate, lowering the stack after an ejection opportunity has passed, whether used or not, and lowering the lifting means below the latest tested plate that has passed the test, so that such a plate is incorporated into the stack before the lifting means is next activated. |
