| 摘要 |
Metal-complex compounds suitable for use in the electroless deposition of said metal are formed in aqueous solution by a method which comprises providing an aqueous solution of the complexing agent, immersing in the solution at least one anode comprising the metal to be deposited and at least one cathode, the anode and cathode being connected to an adjustable current source, applying a current to the anode and cathode to create a voltage difference therebetween which is sufficient to dissolve metal from the anode into the aqueous solution of the complexing agent and thereby form a compound of the metal and complexing agent, and depositing a lesser amount of metal from solution onto the cathode to enrich the solution in the metal-complex compound. In other embodiments of the invention, devices for carrying out the process are also provided. |
