| 摘要 |
<p>An appliance to join wires to modules on semiconductor devices by ultrasonic vibrations is fitted with a bonding arm on which the vibrator and the bonding tool are mounted. This is hinged to a parallel support arm carrying a magnet for the adjustment of wire tensioning clamps which are also mounted on it. This reduces considerably the mass of the parts, which act on the wire, reduced to the point of application of the bonding tool. The wire is not deformed and all joints are well reproducible. Thinner wire gauges can now be processed satisfactorily.</p> |
