发明名称 |
Solder system |
摘要 |
A solder system for metallurgically bonding a semiconductor die to a metal package member. The solder is based on the tin rich corner of the tin-antimony-silver ternary alloy system. The solder system has particular applicability to the bonding of power transistors.
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申请公布号 |
US4170472(A) |
申请公布日期 |
1979.10.09 |
申请号 |
US19770788954 |
申请日期 |
1977.04.19 |
申请人 |
MOTOROLA INC |
发明人 |
OLSEN, DENNIS R;SPANJER, KEITH G |
分类号 |
B23K35/26;(IPC1-7):C22C13/00 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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