RESINNSEALED SEMICONDUCTOR DEVICE AND ITS PACKAGING METHOD,申请号JP19780035536-传众专利搜索

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发明名称	RESINNSEALED SEMICONDUCTOR DEVICE AND ITS PACKAGING METHOD
摘要
申请公布号	JPS54128278(A)	申请公布日期	1979.10.04
申请号	JP19780035536	申请日期	1978.03.29
申请人	HITACHI LTD	发明人	MOMONA HIROSHI
分类号	H01L23/32;H01L23/00;H01L23/28	主分类号	H01L23/32
代理机构		代理人
主权项
地址

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