发明名称 Method of making a heat sink mounting.
摘要 <p>A method of making a semi-conductor heat sink mount- ng includes two extrusion steps. Initially, a substantially :ylindrical copper billet having an upper cylindrical locating portion of reduced diameter is formed. A steel ring is then brazed to the copper billet about the locating portion. The billet and the steel ring are then extruded to form a sink body portion (22), a pedestal portion (24) extending upwardly from the body portion and defining a disc receiving recess, and a resistance welding ridge (27) surrounding the pedestal portion. A molybdenum discs (28) is brazed into the recess in the pedestal portion. A stem (38) is then extruded downwardly from the body portion (22) as a substantially evenly distributed downward force is applied to the body portion, the pedestal portion and the molybdenum disc. This force prevents structural failure of the molybdenum disc by maintaining the disc in compression while the stem portion and the body portion of the heat sink mounting are worked to a full hard state.</p>
申请公布号 EP0004475(A2) 申请公布日期 1979.10.03
申请号 EP19790300486 申请日期 1979.03.26
申请人 THE NIPPERT COMPANY 发明人 NIPPERT, RUSSEL A.
分类号 H01L23/36;B23K1/00;H01L21/48;H01L23/492;(IPC1-7):01L21/48;01L23/48;01L23/04 主分类号 H01L23/36
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